Based on 10-years of research and collaboration between MIT, UC Berkeley, and CU Boulder, and funding from DARPA via the POEM program, Ayar Labs created a solution that overcomes the power/performance scaling challenges of semiconductors as well as the interconnect bandwidth bottleneck between those devices.

Their technology was developed with volume product manufacturing in mind, leveraging high-volume semiconductor and packaging partners. Recognizing that ecosystem is key to successful integration into partner solutions, they are an active member of the CXL, ODSA, and AIB consortiums.